Mini-LED refers to the size of the LED chip in the order of 100μm, and the size is between the small pitch LED and the Micro LED, which is the result of further refinement of the small pitch LED. Among them, the small-pitch LED refers to the LED backlight or display product with the adjacent lamp bead spacing below 2.5 mm.

Mini-LED uses LED chip size of micron level, each Mini-LED circuit board usually has thousands of chips, tens of thousands of solder joints, to connect the RGB three-color chip.

Therefore, compared with the traditional reflow welding process, Mini-LED process requirements to reach the extreme, according to statistics, more than 40% of the poor welding is caused by the printing process, 40% is caused by welding. The other 20% has a lot to do with solder paste and substrate material. For the reliable welding of Mini-LED, higher requirements are put forward for equipment reflow welding, welding process, and material (solder paste), and all three are indispensable.

In such a precise and fine welding process, solder paste plays a vital role as the main bonding material.

Guangdong Zhongshi Metal Co., Ltd. has developed a Mini-LED special solid solder paste for the Mini-LED printing process. It has stable physical properties and oxidation resistance, good printability and film removal, uniform tin, ultra-fine welding powder, so that the amount of tin under stripping is more stable; And has excellent welding reliability, ultra-low void rate, less residue after welding, chip does not tilt, does not shift and other product features.

At present, 5-8# powder can be configured according to customer needs, and can be packaged or canned.

Free sample and order, welcome to contact us!

Contact number: 0769-85231818/400-853-0080